How will future PCBs match the ever-increasing demands of the IT industry?
There has always been the question as to how PCBs can remain relevant and meet the ever-evolving needs of the IT industry. We’ll look deeper into this question in this article. Prototype printed circuit boards are getting smaller in size and now include more and more components and wiring, in an effort to meet the demands of new technologies and electronic products. To reach the required level of miniaturization, circuitry density requires high-density interconnect (HDI). The reduced trace widths & gaps required by HDI design, as well as the utilization of even more components in a reduced space, will require both material and manufacturing advancement. A new generation of IT based on 5G technology with data transmission rates of up to 52G, needs to transmit signals with high integrity and minimal distortion on PCBs. Furthermore, the dielectric constant and dielectric loss of PCB boards need to be kept to a minimum. All this means that the epoxy resin-based substrate is barely